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  5. Dry Film Photoresist

Dry Film Photoresist

incl. GST

1. INTRODUCTION ASAHI KASEI E-MATERIALS DFR TM SUNFORT TM is dry film photo resist developed by our company with a combination of heretofore-developed technologies in photosensitive materials and plastics, for use in the manufacture of printed circuit boards. AQ series is fully aqueous type. The carrier film should be peeled off before developing. SUNFORT TM AQ-4038 is negative working and aqueous processability dry film photo resist which is designed to develop completely in a mild alkaline solution such as sodium carbonate (Na2CO3) and strip in a dilute alkaline such as sodium hydroxide (NaOH). SUNFORT TM AQ-4038 is high performance photo resist in etching/plating application and available in resist thickness of 40um sandwiched between layers of polyester and polyethylene film.

Structure of SUNFORT TM AQ-4038 Film width: Customer size is available in widths ranging from 195 to 600mm in increments of 3mm.

 FEATURES OF SUNFORT TM AQ-4038 (1) Wider latitude of exposing and developing conditions. (2) High resolution and excellent producibility of photo mask after developing. (3) Excellent imaging contrast Unexposed color: Green Exposed color: Dark blue (4) Polymerized resist is tough and has good etching resistance to etchants such as: Ferric chloride (FeCl3) Cupric chloride (CuCl2) (5) Polymerized resist remains firmly bonded to copper surface, and has an excellent chemical resistance to acid electroplating bath such as: Copper sulfate Solder fluoborate (tin/lead, tin) Acidic cleaners, ammonium persulfate and dilute sulfuric acid, can be used in pre-plate cleaning. (6) During stripping, polymerized resist breaks up into small particles and is not soluble in a stripping solution

(Note) A developing solution (Na2CO3) and a stripping solution (NaOH, KOH) should be handled with much care. Wear safety glasses and impervious gloves when making these solutions, and providing maintenance for equipment.

Feature
Service Location India
Minimum Order Quantity 2
Description

1. INTRODUCTION ASAHI KASEI E-MATERIALS DFR TM SUNFORT TM is dry film photo resist developed by our company with a combination of heretofore-developed technologies in photosensitive materials and plastics, for use in the manufacture of printed circuit boards. AQ series is fully aqueous type. The carrier film should be peeled off before developing. SUNFORT TM AQ-4038 is negative working and aqueous processability dry film photo resist which is designed to develop completely in a mild alkaline solution such as sodium carbonate (Na2CO3) and strip in a dilute alkaline such as sodium hydroxide (NaOH). SUNFORT TM AQ-4038 is high performance photo resist in etching/plating application and available in resist thickness of 40um sandwiched between layers of polyester and polyethylene film.

Structure of SUNFORT TM AQ-4038 Film width: Customer size is available in widths ranging from 195 to 600mm in increments of 3mm.

 FEATURES OF SUNFORT TM AQ-4038 (1) Wider latitude of exposing and developing conditions. (2) High resolution and excellent producibility of photo mask after developing. (3) Excellent imaging contrast Unexposed color: Green Exposed color: Dark blue (4) Polymerized resist is tough and has good etching resistance to etchants such as: Ferric chloride (FeCl3) Cupric chloride (CuCl2) (5) Polymerized resist remains firmly bonded to copper surface, and has an excellent chemical resistance to acid electroplating bath such as: Copper sulfate Solder fluoborate (tin/lead, tin) Acidic cleaners, ammonium persulfate and dilute sulfuric acid, can be used in pre-plate cleaning. (6) During stripping, polymerized resist breaks up into small particles and is not soluble in a stripping solution

(Note) A developing solution (Na2CO3) and a stripping solution (NaOH, KOH) should be handled with much care. Wear safety glasses and impervious gloves when making these solutions, and providing maintenance for equipment.

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