Bonding Md300 ASIC Design Services
Description
Die and Wire-bonding belong to our key technologies. We glue or solder dies onto the substrates. They are then wire-bonded protected with a glob-top. We manufacture chip on board as well as chip on chip and chip on ceramic. All common materials and wire thicknesses are used in wire bonding. Our capabilities include Al-wedge-wedge bonds, Au-ball bonds as well as Pt-wedge-wedge bonds for high temperature applications. Our core competences are:
- Chip on Chip or Die on Die
- Chip on
- Ceramic
- Board
- Solder, pick and place
- SMD
- BGA
- Flip-Chip
- Al wedge-wedge bonds
- 17µm to 480µm
- Au-ball-bonds, fine wire
- Pt wedge-wedge-bonds
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